Shielding Options
You can use Form/Met shields at enclosure level, board/system level, or component level. There are a wide variety of options available with Form/Met, including options for which surfaces are metalized (inside, outside, or both), metalizing materials, attachment, Substrate Materials, and other options. For guidance on choosing these options, we advise you contact a WaveZero technical representative.
Enclosure Level Shield
Designed to conform to the inner contours of your product's enclosure, the enclosure level shield completely encapsulates the printed circuit board (PCB). Ventilation and access holes for connectors and wiring can be easily incorporated into the shield's design. Integrating two or more designed-in shield features achieves grounding with corresponding grounding points in the PCB. The ability to provide a pseudo-Faraday cage results in a superior EMI/RFI shielding system compared to other alternatives.
 Figure 1: Enclosure shield with common feature^ back to top
Board/System Level Shield
WaveZero's patented technology, along with years of Form/Met design experience, enables shielding solutions that are cost-effective at any volume and deliver high performance. EMI shield designs are not restricted to straight edges or square forms, and complex shapes can be integrated into any electronic product design.
Attachment and grounding of the electromagnetic shield to the circuit board is accomplished through highly environmentally friendly dispensed electrically conductive adhesives (DECA), die-cut, conductive pressure sensitive adhesives (PSA), or mechanical fasteners.
 Figure 2: Board / System shield with common features^ back to top
Component Level Shield
WaveZero's compartmentalized electromagnetic shielding solutions replace one or more sheet metal cans with a single shield component comprised of multiple compartments. WaveZero designs EMI shields at the component level for any specific challenge.
 Figure 3: Component shield with common features^ back to top
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